TAN KIM SOO

• Oversaw daily Metallization Engineering (Build Up, Laser, Desmear/Electro-less team) to ensure highest productivity from team.
• Led projects and analyzed data to identify opportunities (Capacity, Yield, IPP) for improvement.
• Actively work with customers, handled concerns (NPI product certification, Yield, Run-Rate, New Technologies) quickly and escalated major issues to supervisor.

Achievement:

1. CHQ Plant 3 Progression pull in >1 Quarter thru supplier lead time/shipment pull in, IQ/PQ activities pull in, work with customer for Risk Build approval thru satisfied PQ result.

2. New Front End splitted Organization for Metallization Engineering. Successful formed, organized & trained Metallization Team leader, engineers setup.

• Work closely with customers, internal order handling, quality & production, handled NPI Product Certification to meet internal & customer's requirements.
• Evaluated existing procedures and made proactive adjustments to meet changing demands from Customer/Management (Shorter Schedule, tighten certification criteria's for Yield/Product Parameters/ Lead Time).
• Prepared, checked and coordinated documentation to support component design and application.

Achievement:

1. Successful managed >15 Products certified in 2021 which included new platform 1274 Client & Server thru Setup New NPI procedures & established successful process which able handling massive product concurrently.

2. Drive Engineering team met higher certification yield for Client/Server product & solved chronic NPI phase yield issue.

Average Client yield >90%; baseline

Average Server yield >80%; baseline

• Managed Test Engineering Team which included Open/Short Test, Bump AOI, Final Inspection, Dicing, Final Packing, Via Integrity Measurement & out going rel test module.
• 1st Level Customer Complaint response team to led Task Force for investigate & reporting to customer til close case.
• Used critical thinking to break down problems, evaluate solutions and make decisions.

• Established Bump AOI, Final Inspection, Automated Final Visual inspection, ETEST testing procedures to codify consistent, high-quality approach.
• Enhanced AT&S system operation by introduce more systematic analysis system for Bump AOI/ FI/ ETEST.

Achievement:

1. Successful help team on Plant Certification gating item (C4 Area Non-Wet problem) identified problem source & work on Corrective Action & Preventive Action. C4 Bump non-wet found contacted by vacuum nozzle & wettability of C4 changed.

2. Successful introduce Server BumpAOI for CTV/rCTV measurement system & developed 100% data feed system to customer's server.

• 10 years working in ATM site from shift technician & promoted to CAM process engineering lead.
• Owned CAM (Chip Attached Module) process in Intel Assembly & Test factory. Process included Substrate Preparation, Die Attached, Deflux, Die Inspection & Placement Measurement, Epoxy Dispense module.
• Led & train junior engineers, technician for owned processes.
• Led projects and analyzed data to identify opportunities for improvement.

Achievement:

1. Factory Award: Cost Saving & thru introduce dual feeder system in CAM process, which productivity improved >40% & saved ATM site CAM links from 20 to 14 links in 2013.