Wenhua Zhou

• In TD department and leading a group of members to do the 17nm/15nm/13nm DRAM product development
• Maintain and improve PC/M0 loop process performance
• Qualify the new tool for the production line capability
• Daily process monitor including SPC, RMS, recipe management, OCAP handle, hold lot handle, etc
• Defect case analysis and finding the root cause
• Process cost down and tool localization
• Training the NCG

Project Achievement：

1、 M0 line bridge and broken issue resolution

2、 M0 HM LWR improvement

3、 PC CDU improvement and CD shrink issue resolved

4、 PC sidewall protection and small CD improvement

• In charge of 39L/73L/128L/192L/256L 3D NAND NPI etch module development and volume production
• Contact process yield promoted, meet process criteria, reduce defect and do process CIP
• Daily inline CD monitor
• Be familiar with TEL, AMAT, AMEC, LAM Coronus' operation
• New tools installation, qualification and chamber process extension
• Monitor and manage inline CD, SPC, RMS, OCAP and iEMS system
• Promote tools WPH
• Training new employees

Project Achievement：

1. Contact Sidewall Damage Improvement

2. 39L 3D NAND ETCH module CT development，the production has passed WAT and CP test and start to transfer to new production line

3. 39L CT bowing free CIP improvement

4. 73L 3D NAND CT process development，including SSCT和Peri CT，the process tuning target is to meet CD criteria and profile，and also pass WAT test

5. Resolve the CT OX surface pitting issue

6. CT strip process new recipe development with H2O2 instead of H2N2.

• In charge of thinfilm/etch equipment, including: AMAT Endura5500-PVD, Nexx Nimbus-PVD, Mattson Aspen-CVD, PSK Ecolite2000-DESCUM, TRIMAX-PLASMA Etch
• Mainly focus on RDL and UBM two process layers maintenance, ensure the film thickness and uniformity are stable
• Defect issue improvement, for example: peeling, wafer surface discoloration
• Fine tuning the relative recipe, especially when the setup failed, need to modify the recipe parameter
• Maintain daily SPC chart, FDC system
• Perform troubleshooting and repair related equipment
• Also do schedule and preventive maintenance (PM) on equipment
• Contact with vendor for cleaning the recycled spare parts and purchasing the new parts
• Also learning some good skill and knowledge from them
• Arrange the tool training for AE and TS

Project Achievement：

1. BKM of Nexx PVD Improvement on Deposition Chamber L-shape Side Shield

2. Wafer surface NiV film peeling defect improvement.

3. Improve the parts clean method so as to extend process kit life time.

• In charge of 7 modules about 100 subordinates' daily job including production line control, tool daily monitor, tool maintenance, and daily product output
• Arrange the subordinates to do the tool PM and parts clean and recycle
• Ensure the normal running of equipment and the maximum productivity
• According to the company's instruction to balance the production output target of each customer's production
• Give training to team staff termly so that they can be better to achieve the job
• Hold meetings regularly to sum up the work and arrange the new work plan
• Do the assessment for subordinates as per the company's assessment policy

Project Achievement：

1. PM pass rate above 90%.

2. Tool parts clean method improvement and as cost requirement ,change to clean parts by self instead of vendor.

3. Better product throughput in whole company.

4. Winner of labor skill competition in 2001-2002